More than 200 students from 15+ engineering and technical programs will gather in Birmingham, Alabama, January 17-19, 2026, for the TAPPI-PIMA Student Summit.

 

All weekend long you’ll have the opportunity to witness student leadership in action. “There are so many students who have a hand in the programming and team building experiences for this event,” explains Michael Reuss, chemical engineering major at Auburn University and Student Chair for this year’s planning committee.

 

 

The Student Summit is the industry’s only event that brings together students interested in the pulp, paper, packaging, tissue, and converting industries.  Beyond the typical career fair experience, it offers sponsoring companies, like yours, the unique opportunity to not only conduct interviews, but to also connect with students, immerse in the excitement, and build lasting relationships.

 

 

You’ll save on recruiting expenses while maximizing your exposure to a highly qualified, industry specific talent pool. At no other venue can you find as many paper and packaging engineering students assembled from different programs with diverse levels of skills and education.

 

Students in participating pulp and paper programs entertain at least five serious job offers upon graduation.  TAPPI-PIMA Student Summit can help connect your brand with the future leaders of the industry.

 

The TAPPI-PIMA Student Summit is a once-a-year opportunity to meet and potentially hire your company’s “next gen” leadership. To participate in the interviews, companies must purchase an Interview and Career Fair Sponsorship.  Visit the TAPPIStudentSummit.org to learn more or contact Shane Holt at (352) 333-3345 / sholt@naylor.com.

 

Previous attendees included students from the following universities: Auburn University, Clemson University, Georgia Institute of Technology, Georgia Southern University, Grenoble INP (France), Louisiana Tech University, McMaster University, Miami University, Michigan State University, Mississippi State University, North Carolina A & T, North Carolina State University, Oregon State University, State University of New York, University of Florida, University of Maine, University of Minnesota, University of Tennessee Knoxville, University of Washington, University of Wisconsin-Stevens Point, University of Wisconsin - Stout, Western Michigan University, and Worcester Polytechnic Institute.

 

Current and previous sponsors included: ABB, Andritz, AstenJohnson, Axchem USA, BHS Corrugated North America, Brueckner Group USA, Cascades, Clearwater Paper, Domtar, Ecolab, First Quality Tissue, Georgia-Pacific, Graphic Packaging International, Greenpac Mill, Greif, Hargrove & Constructors, International Paper, Irving Consumer Products, Jacobs, Jedson Engineering, Kiefel Technologies, Nalco Water, Packaging Corporation of America, Pixelle Specialty Solutions, Procemex Inc., RPTA (Recycled Paperboard Technical Association), Sappi North America, Smurfit Westrock, Solenis, Suzano, TAPPI Foundation, TAPPI Gulf Coast Section, Twin Rivers Paper, USDA Forest Service, Valmet, Voith, Wood, and Yates.