TAPPI-PIMA Student Summit: Not Just Another Virtual Career Fair

Become a 2021 Student Summit Sponsor and Meet the Best and Brightest Candidates First

Recruit the next generation of industry leaders and get your brand in front upcoming engineering graduates with participation in the industry’s leading career fair event.

Designed for students interested in the pulp, paper, packaging, and allied industries, the TAPPI-PIMA Student Summit , taking place February 6-7 as a virtual event, will offer students interaction and interviews, as well as the opportunity to gain valuable information about career development, all while collaborating with their peers across the country. 

Why should your company be a supporter?

Save on recruiting and meet the best students.
At no other event can you find as many paper and packaging students assembled from different programs with diverse levels of skill and education.

Maximize your exposure to the candidate pool.
Student Summit puts your company’s employment opportunities front and center to an audience of the best and brightest students. Even if you are currently not hiring full-time positions, there are many students interested in internship and co-op prospects.

Students participating pulp and paper programs receive at least five serious job offers upon graduation. TAPPI/PIMA Student Summit can help make sure your company makes the cut.

Student Summit is an annual event and opportunity to get your brand in front of upcoming graduates. Sponsor this student-focused event to have your company noticed, remembered and pursued by the next generation. First impressions can make all the difference in your recruiting efforts.

Go to TAPPI-PIMA Student Summit for more information, or contact Shane Holt at +352-333-3345 or sholt@naylor.com.



Previous Student Attendees From: Auburn University, Clemson University, Georgia Tech/Renewable Bioproducts Institute, Grenoble INP – Pagora (France), Miami University, Michigan State University, North Carolina State University, Oregon State University, State University of New York, University of Maine, University of Minnesota, University of Washington, University of Wisconsin, Western Michigan University

Previous Sponsors Include: Andritz, BHS Corrugated, BTG Americas, Buckman, Caraustar, Domtar, Georgia Pacific, Graphic Packaging, Greenpac Mill, International Paper, Jacobs, Kemira, Nalco Water, Packaging Corporation of America, SAPPI, Solenis, Twin Rivers, UPM, Valmet, WestRock