Win Free Entry to ACI's 2016 Tech Forum
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This year’s Tech Forum will take place at Indiana Wesleyan University in West Chester, Ohio on May 19. It will feature a Keynote Panel on 3D Technologies, along with breakout sessions covering: Talent Management, BIM & IPD Game Changers, Logistics, Radio Frequency Identification, Social Media and Cyber Security!!
To enter, email: Jseibert@aci-construction.org and send the code: TECH16. The drawing will take place on 5/11/2016.
