Recruiting Talent at 2017 Student Summit - Early Birds Get the Good Recruits!

We are already getting resumes from qualified students attending the TAPPI-PIMA Student Summit! Will you be there to interview them also? Sign up now and get access to resumes as they're posted. No other event will bring you face-to-face with top candidates - up to 200 students from paper engineering and packaging programs - and supply interview booths, networking and special events to help you meet your goals.

Designed for students interested in the pulp, paper, packaging, and allied industries, the TAPPI-PIMA Student Summit offers students direct interaction with industry leaders, as well as hiring and interviewing companies, such as yours. This is the ONLY event that brings students from paper and packaging schools together to reinforce their interest in joining the industry.

These companies are already signed up to interview:

Domtar
Solenis
BASF
First Quality
Kemira
Verso
Green Bay Packaging
Caraustar.

Join this group of proactive companies and begin recruiting through the TAPPI-PIMA Student Summit! Learn more about Exhibiting, Sponsoring and Interviewing.

The 2017 TAPPI/PIMA Student Summit, January 14-16 in Cincinnati, Ohio, USA, is the industry’s leading career fair event. At no other venue can you find this many paper and packaging students assembled together. For the past five years, the Student Summit has continued to set attendance records, and we expect an increase again for 2017.

It is the only event that brings students from paper and packaging schools together to reinforce their interest in joining the industry. In addition to an Engineering Competition, the program include sessions focusing on topics such as Nanotechnology, Printed Electronics, and the State of the Industry, all topics that are not regularly taught as part of their curriculum.