The 2017 TAPPI/PIMA Student Summit, January 14-16 in Cincinnati, Ohio, USA, is the industry’s leading career fair event. At no other venue can you find this many paper and packaging students assembled together. For the past five years, the Student Summit has continued to set attendance records, and we expect an increase again for 2017. 

 

 

It is the only event that brings students from paper and packaging schools together to reinforce their interest in joining the industry. In addition to an Engineering Competition, the program include sessions focusing on topics such as Nanotechnology, Printed Electronics, and the State of the Industry, all topics that are not regularly taught as part of their curriculum.