DuPont and Kellogg's Presenting at Building Electronics On Paper Workshop

DuPont and Kellogg's are among the featured companies presenting at FlexTech Alliance's upcoming workshop "Building Electronics on Paper – Why, How & Who" on August 6-7 at Western Michigan University in Kalamazoo, Mich., USA. This 1.5-day combination of demonstrations, presentations, and networking features industry and academic experts explaining the dynamics of printing electronic circuitry on paper. See the full list of speakers.

Paper 360° is the media sponsor and TAPPI members receive a substantial registration discount. Toward the end of the registration process, enter this code PAPER360 in the "Discount Code" field and click "Apply" to receive the $149 workshop price.
Valuable market insights will be presented, including a keynote from Kellogg's Corporation on smart packaging, while DuPont will explain its experience with printed electronic materials. Other presentations include paper as a novel platform, paper–based touch pads, thermal printing, and paper-based printed circuit boards (PCBs).

Registrants will benefit from the ½ day of hands-on demos at WMU's Center for the Advancement of Printed Electronics (CAPE), which features labs dedicated to inkjet, screen, rotogravure, and flexographic printing. DuPont, Mitsubishi Inks, NovaCentrix, and WMU will provide experts to conduct the demos and explain fabrication methods.

 By attending this workshop, registrants will learn:
Click here for registration and workshop details.