TAPPI Over The Wire Paper 360
Past Issues | Printer Friendly | TAPPI.org | Advertise | Buyers Guide | Travels with Larry Archive FacebookTwitterLinkedIn

Recruit Talent at 2017 Student Summit

Print Print this Article | Send to Colleague

The 2017 TAPPI/PIMA Student Summit, January 14-16 in Cincinnati, Ohio, USA, is the industry’s leading career fair event. At no other venue can you find this many paper and packaging students assembled together. For the past five years, the Student Summit has continued to set attendance records, and we expect an increase again for 2017. 
Your sponsorship allows reduced registration fees for the weekend-long event, and positions your company as a recognized leader in the industry.  

It is the only event that brings students from paper and packaging schools together to reinforce their interest in joining the industry. In addition to an Engineering Competition, the program include sessions focusing on topics such as Nanotechnology, Printed Electronics, and the State of the Industry, all topics that are not regularly taught as part of their curriculum.

Back to TAPPI: Over The Wire

Share Share on Facebook Share on Twitter Share on LinkedIn